Jetting of SMD (Surface Mount Device) adhesives is a high-speed, non-contact dispensing method used to apply precise adhesive dots onto PCBs (Printed Circuit Boards). This technique secures surface-mount components in place prior to soldering and is especially valuable for low-volume, high-mix, and precision-driven applications in SMT (Surface Mount Technology) assembly lines.

What is Jetting?

Jetting employs a piezoelectric or pneumatic actuator to propel tiny droplets of adhesive through a nozzle at high velocity, without the nozzle making contact with the substrate. In contrast to conventional needle dispensing, jetting enables rapid, accurate, and versatile adhesive placement, minimizing defects and enhancing throughput.

Key Advantages of Jetting SMD Adhesives

• Non-contact application: Prevents damage to the PCB or components while achieving high units-per-hour (UPH) rates.
• Ideal for high-mix, low-volume production: Supports flexible manufacturing without extensive retooling.
• High precision: Delivers consistent adhesive volume and placement accuracy.
• Variable dot sizes: Accommodates a range of droplet diameters for diverse component requirements.
• Minimal maintenance: Reduces downtime and operational costs compared to traditional methods.
• No material wastage: Eliminates excess adhesive buildup or residue, optimizing resource use as compared to screen printing process.
• Streamlined programming: Enables quick and easy adjustments for different products as compared to screen printing process.
• Cost savings: Avoids the need for expensive stencils or masks.

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